LTCC (Low Temperature Co-fired Ceramic) filters offer significant advantages in packaging, primarily due to their high level of integration. The LTCC process allows inductors, capacitors, vias, and shielding structures to be co-fired within multilayer ceramics, enabling three-dimensional integration of passive components. This greatly reduces the need for external parts and results in a smaller and more compact filter structure.

Secondly, LTCC provides excellent thermal stability and mechanical reliability. Ceramic materials have a low thermal expansion coefficient and strong resistance to high temperature and humidity. After packaging, the filter can operate stably under high power density and harsh environments, making it suitable for applications such as 5G and radar that require strong temperature stability.

Lastly, the LTCC packaging process supports effective electromagnetic shielding. Internal grounding layers and metal shielding structures can be incorporated to suppress parasitic coupling and external interference, improving the filter’s Q-factor and overall performance. In addition, LTCC is compatible with standard SMT packages, enabling mass production, automated assembly, lower costs, and high consistency.

Yun Micro, as the professional manufacturer of rf passive components, can offer the cavity filters up 40GHz,which include band pass filter, low pass filter, high pass filter, band stop filter.

Welcome to contact us: liyong@blmicrowave.com