The thermal performance of LTCC filters is relatively good but comes with certain limitations. Their substrate is made of low-temperature co-fired ceramic, which offers high thermal stability and good thermal conductivity, allowing the device to maintain stable electrical characteristics across a wide temperature range. In addition, the ceramic’s low thermal expansion coefficient helps improve reliability and reduces stress-related failures caused by temperature variations.

However, LTCC filters are typically compact with limited surface area for heat dissipation. Under high-power or high-frequency conditions, heat may concentrate locally, leading to performance degradation or even damage. In practical applications, optimized electrode distribution, thermal channel design, and integration with system-level cooling solutions (such as heat sinks or PCB thermal conduction) are often used to ensure stable operation.

Overall, the thermal performance of LTCC filters is sufficient for most mobile communication, IoT, and automotive electronics applications, but additional thermal management measures are required in high-power RF scenarios.

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