The packaging and interconnection methods of LTCC filters mainly include gold wire bonding and surface-mount metal termination, each with distinct characteristics.

Gold wire bonding uses ultrasonic or thermocompression techniques to connect the chip electrodes to the package leads with fine gold (or aluminum) wires. This method offers high reliability, low parasitic parameters, and excellent high-frequency performance, making it suitable for demanding applications. However, the process is relatively complex, with higher manufacturing costs and lower production efficiency.

Surface-mount metal termination, on the other hand, employs solder paste and reflow soldering to attach the LTCC filter directly onto PCB pads. This simplifies assembly, supports large-scale production, and provides advantages in cost and efficiency. However, parasitic inductance and capacitance from the solder joints are higher, which may slightly affect high-frequency performance and consistency.

In summary, gold wire bonding prioritizes high-frequency performance and reliability, while surface-mount metal termination emphasizes mass production and cost-effectiveness.

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